Product
NEMST-2002 series
Plasma Cleaner
- High-Density Plasma Source (ICP): ~ion density about 1011~1013/cm3.
- Two Electrodes Design (ICP & Electric Field Enhanced Electrode).
- The Direction of Ion Mobility can be controlled.
- Deep Plasma Penetration: uniform plasma penetration for 300mm.
- Multiple Processing Gas Selectivity.
- Low Gas Flow Rate.
- 38 Operation Programs can be stored in memory.
- Operation Mode: manual or auto mode.
- Chamber Capability: 6~10 magazines in general cases or 10~15 tray carriers.
- High Automation and Operator Friendly Design.
- Apply to Non-Slotted or Slotted Magazines.
- Apply to 10~15 tray carriers.
- Multiple Processing Gases (Ar, O2, H2, mixed gas, etc.) can achieve the best surface cleaning and treatment effects.
- Physical, Chemical, or Physical/Chemical Mode Cleaning Method.
- Very High Cleaning Efficiency.
- Extremely High Cleaning Uniformity.
- In general, 20 BGA strips per magazine can be well conducted.
- In general, 20~40 Lead Frame strips per magazine can be well conducted.
- Very High UPH (In General, 480~1440 BGA strips/hr, Lead Frame strips/hr, or up to 10K 1.5” LCD Panel).
- Very Little Gas Consumption.
- Target Applications: Ideal for IC/LED Packaging (substrate cleaning prior to Die Bonding, Wire Bonding, or Molding), LCM, SMT, and more.
- Versatile Substrate Support: Capable of cleaning various substrates and lead frames, including Flip-Chip, BGA variants (PBGA, Window-BGA, Mini/Micro-BGA, TFBGA, LFBGA, VBGA, Pin BGA), QFN/MLP, TCP, PCB, COB, and Lead Frames (Cu, Ag-Plated, Fe, MMC, SD/Micro-SD, etc.).
- LCM Process Excellence: Specifically applicable to the cleaning of Glass and ITO Leads prior to COF, COG, and Tape processes in LCM assembly.